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EF2 - Electro Fine Forming - Electroformed Mask - Electroformed Stencil - Electroformed Screen - Electroformed Mesh - Solder Ball Stencil
Solder Bump Stencil - Solder Paste Stencil - BGA Ball Placement Tool - Precision Screen Mesh - COB Stencil

Electro Fine Forming technology (EF2) was uniquely developed by Kyushu Hitachi Maxell (KHM),
and is a cornerstone electroforming technology used to support the electronic industry’s increasing demands
for component miniaturization with micron-level tolerances and resolutions.

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