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EF2 - Electro
Fine Forming - Electroformed
Mask - Electroformed
Stencil - Electroformed Screen
- Electroformed Mesh - Solder
Solder Bump Stencil - Solder Paste Stencil - BGA Ball Placement Tool - Precision Screen Mesh - COB Stencil
Electro Fine Forming technology (EF2) was uniquely
developed by Kyushu Hitachi Maxell (KHM),
and is a cornerstone electroforming technology used to support the electronic industry’s increasing demands
for component miniaturization with micron-level tolerances and resolutions.
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